XCVC2602-1LSENSVH1369 AMD

Part No.: XCVC2602-1LSENSVH1369 AMD

Description: XCVC2602-1LSENSVH1369

MOQ: 1PCS       

Lead Time: within 1 week

Supplier: INGKE Technology

Category:Integrated Circuits (ICs)Embedded System On Chip (SoC)

Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Manufacturer:AMD

Speed: 400MHz, 1GHz

Series:Zynq®-7000

Primary Attributes: Versal™ AI Core FPGA, 820K Logic Cells

Packaging:Tray

Operating Temperature: 0°C ~ 100°C (TJ)

Package / Case: 1369-BFBGA, FCBGA

Architecture:MCU, FPGA

Supplier Device Packageage: 1369-FCBGA (35x35)

Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

Size:256KB

Email: emily@ingketech.com

           Emily@ingkechips.com 

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