XCVM2502-1LLIVSVI1760 AMD

Part No.: XCVM2502-1LLIVSVI1760 AMD

Description: XCVM2502-1LLIVSVI1760

MOQ: 1PCS        

Lead Time: within 1 week

Supplier: INGKE Technology

Category:Integrated Circuits (ICs)Embedded System On Chip (SoC)

Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Manufacturer:AMD

Speed: 400MHz, 1GHz

Series:Zynq®-7000

Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells

Packaging:Tray

Operating Temperature: -40°C ~ 110°C (TJ)

Package / Case: 1760-BGA, FCBGA

Architecture:MCU, FPGA

Supplier Device Packageage: 1760-FCBGA (40x40)

Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

Size:256KB

Email: emily@ingketech.com

           Emily@ingkechips.com 

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